Brand-New and absolute unused Kokusai large batch deposition equipment

Useable for 

• Thin film deposition

• CVD/oxide film deposition

• Platform V3J3N

• Wafer size 200mm
• Original planned (not used) process name: HQ-SiO
• Product Wafer Load Size:100
• Process Temperature Range: 600-750 C
• Main Body ~ Utility Box (L): 2000 mm

•  See also Kokusai Webpage

LND1-42-3A DESPATCH CURING OVEN

DESPATCH EPOXY-CURE DESPATCH_LCD2-14NV-3

DESPATCH EPOXY-CURE DESPATCH_LCC-14NV-2

DESPATCH PASSIVATION-DRY DESPATCH_LV2NDESPATCH PASSIVATION-DRY DESPATCH_LV2N

DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5DESPATCH PASSIVATION-DRY DESPATCH_LCD2-14N-5

Tool is located in a external storage

nearly in new condition

currently installed and in production state

LND1-42-3 DESPATCH CURING OVEN

LND1-42-3A DESPATCH CURING OVEN

LND1-42-3 DESPATCH CURING OVEN