Semiconductor Assembly

  3. Scrap 3x mini buffers (10011500,10011501,10011502)

    Other Assembly / Hybrid

    Scrap 3x mini buffers (10011500,10011501,10011502)

    These 3 mini buffers (10011500,10011501,10011502) will be scrap because

    1: linked machines were already scrapped 

    2: function isn't complete

  6. Die Sorter (Pick & Place)

    Other Assembly / Hybrid

    Die Sorter (Pick & Place)

    Transferring die from sawn wafer (mounted frame) to die plate or tape and reel.

    Location is at Infineon Penang.